Table of Contents

    CFD Simulation: Validating SOLIDWORKS Flow Simulation for Thermal Analysis

    Cfd-Simulation-Validating-Solidworks-Flow-Simulat

    Written by: Tom McHale

    Published: Sep 7, 2023
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    Table of Contents

      SOLIDWORKS Simulation is used to predict a wide range of design and engineering scenarios using real-world physics in a virtual environment.

      In this series, we’re looking at three simulation applications: fluid dynamics, linear analysis, and electronic cooling. We’ll validate the results of these studies to show you how accurate virtual testing with SOLIDWORKS can be.

      Last time we looked at how we could validate the performance of the finite element analysis (FEA) software SOLIDWORKS Simulation through a pre-tensioned pin.

      CAN I TRUST SOLIDWORKS SIMULATION?

      We’re putting SOLIDWORKS Flow Simulation to the test with a conjugate heat transfer scenario, comparing thermal resistance data from an experimental test rig against a virtual setup in SOLIDWORKS Flow Simulation.

      Comparing results from the virtual analysis against physical test data is an excellent way to validate and have confidence in the software, as it proves that it can replicate what happens in a real-world scenario.

      Ultimately, this allows you to predict whether a new design will meet its intended purpose prior to investing in prototyping or production, resulting in significant time and cost savings.

      Preparing the Model for Analysis

      The setup involves a computer chip (power transistor) and heat sink described in Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration by Ventola et al.

      The experimental test rig described by Ventola et al. is show below.

      01 setup

      A computer chip (transistor) is mounted on a heat sink which has a thermocouple fitted to record the temperature. This is then fitted into a ducting system with fan to provide cooling.

      To replicate the test rig, a 3D CAD model was created in SOLIDWORKS.

      02 transistor model

      A chip component provides the heat power.

      03 heat sink

      An aluminium heat sink sits on top.

      04 spec

      A thermal contact resistance was also assigned to the faces between chip and heat sink of 7.75e-5 K.m2/W

      An air cavity was created which surrounded the fins of the heat sink (at ambient pressure and temperature). This meant the flow simulation could be considered as an internal study.

      Heat conduction and gravity were also activated.

      BOUNDARY CONDITIONS

      05 boundary conditions

      STUDIES

      Several studies were run at various volume flow rates corresponding to different fan speeds on the experimental test rig.

      06 studies

      Each one corresponded to a particular air temperature and heat power on the chip.

      MESH

      A mesh sensitivity study was run with just under 2.5 million cells.

      07 mesh

      The outputs of this showed little difference when compared against a faster model containing less than 90 thousand cells (within 4%).

      Results for the fast simulation are reported for all except the test case (marked with an *).

      Results

      08 results table

      Comparison of results from hand calculation (analytical), test rig data (experimental) and SOLIDWORKS Flow Simulation results.

      The following formula was used to calculate the thermal resistance:

      09 thermal resistance equation
      10 thermal resistance graph

      FLOW SIMULATION PLOTS

      11 cut plot

      2D cut plot showing velocity.
      12 surface plot
      3D surface plot showing temperature.
      13 temperature iso
      14 temperature iso 2
      ISO surface plots showing temperature.
      15 temperature velocity 2d
      2D Cut plot showing temperature with velocity vectors.
      16 transverse temp
      2D Cut plot showing temperature (transverse).

      CONCLUSION: SOLIDWORKS SIMULATION IS RELIABLE

      SOLIDWORKS Flow Simulation matched the experimental test rig data to within 4% of the calculated thermal resistance values. This is an excellent result.

      From this point onwards, having a validated model means the effect of any new design changes can be quickly investigated through SOLIDWORKS Flow Simulation with confidence to avoid any costly failures.

      It can also help to optimise the design by answering questions such as:

      1. Can a cheaper fan be used?
      2. Would a higher power chip overheat?
      3. Does the heat sink need to be so big?
      4. Would other components be cooled enough if added?
      5. Can the position of the fan be changed to make the design more compact?
      6. Would restricted access cause ventilation dead spots?

      Adding the power of SOLIDWORKS Flow Simulation to your design portfolio means having the ability to answer all these questions more. It allows you to design in an affordably rapid manor and try out many “What if…?” scenarios that would simply take too long, or be too costly by and other method.

      Take the Next Steps…

      If you need help with SOLIDWORKS Simulation, our team can help you achieve accurate results and sharpen your skills.

      Here’s a quick rundown of how we can help you get the best from SOLIDWORKS Simulation and virtual testing with our Simulation services.

      Not only do we offer CPD-accredited training courses, but also finger-tip access to an expert Technical Support team and consultants who will tailor to your needs.

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      Get a SOLIDWORKS Quote

      Interested in SOLIDWORKS? Contact us for questions, trials, or demos by clicking the button below or call 01926 333777. Our experts will help you find the perfect solution.

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